Description
Fabrication Of 6 Layer Pcbs Glass Epoxy, 2.4 Mm Thickness With Solder Mask And Legend Print Copper Thickness : 105 Microns Pcb Size : 210mm X 120mm Pcb Name : H-bridge_ Sot-227 Pcb Finish: Enig Photo Plotting Required Bbt Required P/n: Bgf Pe 06 0948 A
Tendering Authority: Department Of Electronics And Information Technology
India, Kerala, Thiruvananthapuram
NTID
29975093
Last Date For Submission
08 Dec, 2022
Closing Date
08 Dec, 2022
BOQ Items Total Items : 2 | Total Qty : 15
| # | Item | Quantity | Units |
|---|---|---|---|
| 1 | Electrical Items : | ||
| 2 | Fabrication of 6 layer PCBs Glass epoxy, 2.4 mm thickness with solder mask and legend print Copper Thickness : 105 microns PCB size : 210mm X 120mm PCB name : H-BRIDGE_ SOT-227 PCB Finish: ENIG Photo plotting required BBT required P/N: BGF PE 06 0948 A | 15.00 | Nos |
